Simple and compact single-axis grinder. The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. Space-saving design. Equipment dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm. Precision grinding
The processing quality of ultra-thin finishing grinding can also be improved by using the Poligrind wheel, but a layer of powder (albeit slight) remains on the wafer surface due to processing using a grinding wheel. DISCO can supply various processes to meet customer needs regarding stress relief technology and which further improves the die ...
This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). ... (TAIKO and Package Grinding) Related Equipment: …
Discover DISCO's leading-edge wafer grinding, lapping, and polishing equipment, renowned for unmatched precision and efficiency. From the DFG 841 to the DFG 8540, DISCO offers a wide range of systems utilizing their unique "DFG" process for uniform material removal. Experience high-speed grinding, superior surface quality, and sub …
Sioux-Style Valve Seat Grinding Tools & Equipment; Sioux-Style Valve Seat Stones; Irontite; Cylinder Head Supplies Expand child menu. Valve Seat Work Expand child menu. Valve Seats; 3-D Fast-Cut; ... Angle Grinder Adaptors for Valve Seat Grinding from $109.99; GV-147 | 4" x 1" x 5/8" Valve Refacing Wheel $49.99;
Axus Technology can help you choose the right wafer grinding equipment to provide precise control, exacting dimensions, and challenging specification solutions. Precise wafer thickness control is critical in manufacturing integrated circuits, MEMS, LEDs, and Nanotechnology devices. Edge Profiling (or Grinding), and Edge Trimming are …
Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series. Thin grinding (100 µm) ... The DFG8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8160) for in-line processing solutions. Improved …
Leveling the Machine Equipment you must have ready Level gauge (Minimum calibration: 20 μm/m) Adjustable wrench Procedures to level the machine NOTICE Gently place the level gauge at its designated position in the machine If the level gauge installing surface is flawed, it may adversely affect the machine's grinding accuracy.
The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to DISCO. This base delivers grinding water even more efficiently than the IF Series, resulting in highly consistent processing and optimized wheel life. Bond selection is identical to that of the IF Series, making transition easy.
Achieves smaller chipping than the existing blade for both the front and backside, and longer blade life. Workpiece. Borosilicate glass 0.7 mmt. Blade. New R07-SDC600-BB101-75. Current P1A851 SD600R10MB01. Spindle revolution. 20000 min -1. Feed speed.
Equipment dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm. Precision grinding. Adoption of high-rigidity, low-vibration spindle provides superior grinding results and is capable of …
DFG 840. Wafer back grinder, 1998 vintage. 52. Find deals on Used DISCO DFG 840, or send us a request for an Used DISCO DFG 840 and we will contact you with matches available for sale.
Best Equipment for advanced Dicing-Grinding Service. DISCO's high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant …
Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for …
DISCO dicing saws and quality equipment - dicing … - Servicing Disco Grinding Equipment. Disco DFG840 and 841 Systems With two-spindle, two-chuck table specifications and a robot arm, the Disco 840 and 841 machines feature a same-cassette return function The robot arm vacuum ensures that even thin-ground wafers, which are …
Street reduction. Stealth Dicing™ process is expected to increase the number of die that can be obtained from a wafer compared to normal dicing because it is possible to make the necessary street width (cut width) narrower. This is a particularly effective processing method for long shaped die, such as line sensors.
The DFG8540/8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140/8160) for in-line processing solutions. ... DFG8540 is the successor to the DFG800 series, equipment …
DISCO continued to make thinner and thinner grinding wheels, with the MICRON-CUT, a 40 micron thick wheel. Many equipment makers and industrial firms began to blame DISCO for damage because …
Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines; ... DGP8760 offers grinding and polishing in one complete unit. DFP8140. DFP8160. DGP8761. Dry Polishing Wheel. DISCO's specially-developed wheel for stress ...
Available for various workpieces up to Φ8 inches. DFG8640 is a fully automatic grinder equipped with two spindles, three chuck tables, and one turntable. This equipment supports various workpieces up to Φ8 inches, including difficult-to-process materials such as Silicon, LT, LN, and SiC.
servicing disco grinding equipment - bhakti.be. Disco DFG840 and 841 Systems With two-spindle, two-chuck table specifications and a robot arm, the Disco 840 and 841 machines feature a same-cassette return function The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for …
DISCO grinding and polishing machines and abrasive equipment - dicing-grinding service. Services. Quality. Machines. Company. News. Contact. All. Dicing Saws. Laser Dicer. Grinder and Polisher. Metrology/AOI. …
GET ALWAYS THE LATEST INFOS AND NEWS. Dicing saws for dicing grinding service. High quality dicing with DISCO dicing blades.
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Sapphire × LLO. Ceramics and Dicing Using Blades. Ceramics × Blade Dicing. Sealing Resin and Mold Resin with Grinding Using Wheels. Sealing Resin and Mold Resin × …
Processing Conditions. As stated above, it is generally advisable to dice thin wafers with an extremely fine-grit blade. But because these blades have reduced cutting power, they can be affected by films, TEGs, and other …
UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain a gettering effect, which …
Available for various workpieces less than Φ8-inches in size. DFG8340 is a simple and compact fully automatic grinder which adopts a single spindle, dual chuck table, and single turn table structure. It can process silicon wafers less than 8- inches with low-damage low-amount processing, and SiC, sapphire, and ceramics.
Product Information. Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines. Dicing Saws. Laser Saws. Grinders. Polishers. Wafer Mounter.
Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.2 t (28% less than DFG850) while maintaining the same basic specifications and performance level as the 800 series.
DISCO HI-TEC EUROPE . Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. dgs@discoeurope
DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. NCG avoid the risk of breaking wafer which is weak in load, for example the cavity configuration or a wafer ultrathinning.
The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. By using this method, it lowers the risk of thin wafer ...
Dicing-Grinding Service at. DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer …
The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to DISCO. This base delivers grinding water even more efficiently than the IF Series, resulting in highly consistent processing and optimized wheel life. ... FOLLOW the instruction manual of the equipment to mount the precision tooling properly. DO ...
Since 1983, Rush Machinery has been a leading provider of grinding machines. Rush added wheel truing and dressing machines in 2005. With a proven commitment to service and innovation, our top-quality products help customers meet and exceed their production goals. For manufacturers that work with materials such as carbide and use diamond and …
Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in processes or addition of equipment, Poligrind helps improve post-grinding surface roughness, die strength, and overall process quality. Can be used with current grinding equipment. Improves die strength and other quality factors over ...
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